Intel Announces the 14A (1.4nm) Process Node, Next-Gen 18A Based ‘Clearwater Forest’ CPUs Now Taped-In, and IFS Sees a Rebrand to ‘Intel Foundry’
Intel has just showcased a new roadmap, doubling down on the company’s goal of delivering 5 nodes in 4 years. At the IFS Direct Connect 2024, Intel unveiled a 1.4nm class node called ‘Intel 14A‘. Moreover, the giant is expanding its existing lineup with enhanced revisions.
Clearwater Forest CPUs are now taped in, set to utilize the CPU Tiles manufactured using Intel 18A (1.8nm). Intel’s fearless ambitions of snatching TSMC’s crown are starting to transpire as Microsoft also announced new chips that use the Intel 18A process. By 2030, IFS, now rebranded to Intel Foundry aims to become the 2nd largest foundry in the world.
Intel 14A Announced: 5 Nodes in 4 Years Now Becoming a Reality
We finally have a successor to Intel 18A. As a 1.4nm class node, Intel 14A will be the industry’s first process node to use high-NA EUV technology. For some context, ASML recently supplied such lithography machines to Intel. TSMC, on the contrary, will not use these measures until 2030.
We neither have performance estimates nor density metrics for Intel 14A. What we do know from Intel 18A and 20A is that it should build upon GAA, RibbonFET, and PowerVia.
Amongst the glim, we also see some other interesting mentions such as Intel 14A-E and whatnot. Intel will expand its portfolio by offering enhanced versions of its process nodes. The P suffix indicates a performance improvement, with T indicating TSVs enabling 3D Stacking and E for Feature Extension.
Clearwater Forest Taped-In: Intel 18A CPU Tile, Intel 3 Base Tile and 3D Stacking
Clearwater Forest, a next-gen Xeon E-Core based processor lineup is now taped-in with design staring in Q2 2024. These CPUs use the Intel 18A fabrication process for the CPU Tiles, stacked atop an Intel 3-built Base Die. 3D stacking is said to be a crucial element, possibly allowing HBM4 memory, enabled by Foveros Direct.
UCIe is also a new and exciting technology launching with Clearwater Forest, which is an open standard for die-to-die interconnect. These CPUs are the first high-volume offerings to make use of this interface.
IFS Sees a Rebrand: Intel Foundry Develops New Partnerships With the Likes of Microsoft
IFS or Intel Foundry Services is being renamed to Intel Foundry, simplifying the name. However, Intel Foundry now positions itself as a ‘systems foundry‘ which as per Intel packs system-level design, technology development, supply chain capabilities, packaging, connectivity fabric solutions and even cooling technology under one umbrella.
ASAT or Advanced System and Test also sees an upgrade with the inclusion of FCBGA 2D+. ASAT integrates Intel’s technologies on custom-built chips. Similarly, we also have a new Intel 12 node in the pipeline that stems from Intel’s partnership with UMC. Following the same trend, Intel will also produce 65nm-based chips for Tower Semiconductors, since not all hardware needs cutting-edge technology.
Adding to the already growing number of affiliated partners, Microsoft has also announced a new chip design using Intel’s 18A technology. Microsoft Chairman and CEO Satya Nadella cites the need of ‘a reliable supply of the most advanced, high-performance, and high-quality semiconductors‘ as to why they picked Intel 18A.
In total, across wafer and advanced packaging, Intel Foundry’s expected lifetime deal value is greater than $15 Billion.
Source: Intel, Tom’s Hardware
