TSMC’s 3nm Production on Track and Ready to Fulfill Orders

According to the CEO of the chip manufacturing company, there is no truth to earlier rumors that TSMC would switch from its 3nm (N3) process to the more sophisticated N3E form.

Economic News Daily reports that TSMC CEO C. C. Wei has commented on the difficulties of mass-producing 3nm wafers. He asserts that the most significant obstacle is a staffing scarcity for 3nm R&D, which the company is working to address. We assume that Apple would be among the numerous enthusiastic clients of TSMC’s N3 technology, as stated by Wei.

Apple’s latest M2 Pro and M2 Max are set to integrate TSMC’s technology.

According to reports, TSMC currently employs over 2,000 people in its 3nm R&D division, with plans to hire more personnel. It was reported that Apple’s M2 Pro and M2 Max were mass produced using TSMC’s 5nm process, which suggested that the company’s 3nm node was either having issues or had been completely abandoned in favor of the enhanced N3E. It appears that TSMC has everything set up to ensure that it delivers orders for various clients, including the iPhone manufacturer.

A17 Bionic, which will only be utilized for the iPhone 15 Pro and iPhone 15 Pro Max, is one of Apple’s following devices that will benefit from TSMC’s 3nm technology. The A17 Bionic’s specs have not been made public, but it is anticipated that Apple will stick with its 6-core CPU architecture, which has two performance cores and four for battery economy.

As the largest purchaser of TSMC’s most recent technology, Apple has a long-standing cooperation with the company. It is clear from a recent report that TSMC has started producing 3nm chipset that Apple has chosen to use the technology in its upcoming devices.

Read MoreiPhone 15 and iPhone 15 Pro Max to Feature Apple’s Cutting-Edge A17 Bionic Chipset





Muhammad Zuhair

Passionate about technology and gaming content, Zuhair focuses on analysing information and then presenting it to the audience.
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