The next generation of consoles is around the corner. Both Microsoft and Sony have confirmed their launch titles and the final previews of Series X are already out. Things on the PlayStation 5 side are a little slow, but Sony is regularly pouring down relevant information. Two weeks ago, Sony released the PS5 teardown, and a few days ago, we saw the first look at the new PS5 UI.
The PS5 teardown revealed an elaborate and beefy cooling solution that was mostly responsible for an odd yet elegant design of the PS5. The console had two holes to clear out dust and debris, a chunky fan that can direct air to both sides of the motherboard, liquid metal as a thermal contact between the APU and the gigantic heat sink. The cooling design screams that a lot of thought has been put into the design to keep the thermals and noise in check.
According to a recent interview of Yasuhiro Ootori with 4Gamer.net, the PS5 fan speed will depend upon the data generated from individual games. He explained that there are four temperature sensors onboard, one of which is inside the APU. These sensors will collect data, and the highest reading will be used to dictate the fan speed. It means the fan could be loud at times but only for the most demanding titles.
Additionally, Sony will also be monitoring the APU and collecting relevant data for individual games. Otori said the data would be used to figure out fan speeds depending on the games. The relevant fan speed updates will presumably be a part of the firmware updates.
Lastly, Otori also answered the most asked question related to the external SSD’s cooling. He said that there are ventilation holes inside the casing, which will stop the SSDs from overheating.