Hardware

Ryzen 3rd Generation Engineering Sample Spec Leak Confirms 16C/32T CPU in Lineup

AMD has a lot of exciting products in its pipeline and expectations are running high for the Ryzen 3000 series launch. Ryzen’s first launch back in 2017 helped consumers get a second option in a market dominated by Intel. Ryzen 2000’s launch last year greatly improved on the launch formula, offering higher clock speeds and more cores. Ryzen’s 3000 series is expected to do more of the same, offering even more cores (according to leaks) and higher clock speeds.

So far leaks have indicated 16C/32T processors in the Ryzen lineup, something which was only seen in the Threadripper chips. This tweet above confirms the same. It indicates a Zen 2 engineering sample with 16 cores. It is running on an x570 board with a base clock of 3.3 GHz and a boost clock of 4.2 GHz. The clocks are on the lower side, probably because it is an engineering sample. The Ryzen 2700x can do 4.2 GHz with a decent overclock, so similar 3000 series chips should go higher.

Some Engineering samples from 1st Gen Ryzen had a 2.7GHz base/ 3.2GHz turbo, which on launch had 3.6 GHz base/4 GHz boost. We can expect improvements along the same line on release. The sample chip here is probably the Ryzen 3800, which according to leaks is supposed to have 16 cores.

Zen 2 Architecture

Zen 2 will be on TSMC’s 7nm process which will include this year’s Ryzen and Epyc Rome chips. Rumors suggest an IPC increase in the range of 10 and 20 percent.

The floating-point unit underwent major modifications in Zen 2. In ZenAVX2 256 bit single and double precision vector floating-point data types were supported through the use of two 128 bit micro-ops per instruction. Likewise, the floating-point load and store operations were 128 bits wide. In Zen 2, the datapath and the execution units were widened to 256 bits, doubling the vector throughput of the core.

With two 256-bit FMAs, Zen 2 is capable of 16 FLOPs/cycle.

Wikichip

This will directly increase the CPU’s pure throughput. Zen 2 also uses Infinity Fabric 2, which will offer higher transfer rate per link aka faster communication between cores, also helping keep memory latency uniformly low. Power consumption for similar performance should be lower due to the smaller process.

X570 Motherboards

Ryzen 3000 series chips will be backward compatible as they will use the same AM4 socket, given power requirements are met. x470 boards with Ryzen 2000 series chips brought support for Precision Boost Overdrive and XFR 2.0. Ryzen 3000 series chips with x570 boards will bring support for PCIe 4.0.

PCle 4.0 should also work in some x470 and x370 boards, TomsHardware in one of their articles stated “We spoke with AMD representatives, who confirmed that 300- and 400-series AM4 motherboards can support PCIe 4.0. AMD will not lock the out feature, instead, it will be up to motherboard vendors to validate and qualify the faster standard on its motherboards on a case-by-case basis. Motherboard vendors that do support the feature will enable it through BIOS updates, but those updates will come at the discretion of the vendor. As mentioned below, support could be limited to slots based upon board, switch, and mux layouts.

AMD will officially launch the Ryzen 3000 series in Computex this year, which is only a few weeks away.


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