As we approach the new year, NVIDIA, Intel, and AMD are all getting ready to launch new products and duke it out for our pockets. Intel is preparing its slate of non-K Alder Lake desktop CPUs along with Alder Lake-S mobile CPUs. NVIDIA will soon be announcing a bunch of new GPUs including the RTX 3090 Ti. And, AMD is releasing new mobile CPUs under the Ryzen 6000 “Rembrandt” lineup. While we already know a lot about all of those, it’s actually AMD’s upcoming next-gen Ryzen 7000 “Raphael” CPUs that are the subject of today’s leak.
Ryzen 7000 is the direct successor to the current-gen Ryzen 5000 “Vermeer” desktop processors. It’s supposed to launch later next year and purportedly brings forth a myriad of improvements along with it. Before that, though, AMD will be launching Ryzen 6000 at CES 2022. This will be sort of a mid-cycle refresh for AMD’s mobile APUs with the big difference coming in the iGPU department. Ryzen 6000 will be equipped with RDNA 2 integrated graphcis, a massive leap over the outdated Vega architecture. But, that’s not the focus of this article; let’s talk about Zen 4.
– Zen 4 in Computex, and seems only suport D5 (cpu can both)
– X670 will have no itx due to too many features
– Mobile Rembrandt CES, desktop APU on 22 Q3 https://t.co/qrDoSaDXgN
— 포시포시 (@harukaze5719) December 22, 2021
Ryzen 7000 Zen 4
As mentioned, Ryzen 7000 will be based on the new Zen 4 microarchitecture and fabricated on TSMC‘s 5nm node. Just like Ryzen 6000, the Zen 4 architecture will enable Ryzen 7000 to have RDNA 2-based iGPUs. Ryzen 7000 will also presumably up the maximum core count of its top-end CPU as compared to previous generations. The current flagship Ryzen 9 5950X features 16 cores and 32 threads, so expect an increment in the topology for the Ryzen 9 “7950X“.
Zen 4 is also said to have a 25% uplift in IPC over Zen 3. That’s a massive improvement when you consider the uplift from Zen 2+ to Zen 3 was 22%, and Ryzen 5000 was an incredible performer. The clock speeds being thrown around right now indicate frequencies of around 5Ghz which is a barrier AMD has not been able to break officially so far. Moreover, the 3D V-Cache chiplet design announced earlier this year will make its debut on Ryzen 7000 aka Zen 4, before they make their way over to the Ryzen 6000 desktop.
While the flagship segment of the Ryzen 7000 “Raphael” features a 170W TDP (reserved for the highest-end chip), recommended for liquid coolers only, there are actually five other classes as well. Then there’s the 120W TDP CPUs which is most likely the not-insane Ryzen 9 variant (perhaps the Ryzen 9 7900X). That is then followed up by 105W chips which could be Ryzen 7. The final category is 45-105W which includes everything from Ryzen 3 to Ryzen 5. This makes even more sense when you learn that this segment requires only standard heatsink solutions.
Thanks to the tweet attached above, we now know that AMD is planning to announce Zen 4 at Computex 2022, which is being held in May. But, we won’t see the CPUs actually release until Q3 or Q4 2022. Just as a reminder, Ryzen 6000 mobile APUs (Zen 3+) will be revealed at CES 2022 in January, and the desktop Ryzen 6000 (Zen 3D) will see a late 2022 reveal.
Ryzen 6000 & the difference between Zen 3+ and Zen 3D
Ryzen 6000 APUs will also see a desktop release in late 2022 after Zen 4 launches. The desktop Ryzen 6000 will be based on the Zen 3D architecture whereas the mobile version is based on Zen 3+ architecture that does not feature the 3D chip-stacking tech. Zen 4, in comparison, is the successor to all of this and will take advantage of new Zen 4-based 3D V-Cache chiplets.
Zen 3D will be manufactured on TSMC 7nm node but will be optimized for better performance. It will feature up to 64MB of stacked cache per CCD which will lend a 15% average performance increment in gaming. This wasn’t known before when we covered Zen 3D, but now it’s common knowledge that Zen 3D will be compatible with the AM4 platform so all existing motherboard should work. The laptop version of Ryzen 6000 aka Zen 3+, will be on the FP7 socket, for context.
While Zen 3+ and Zen 3D are basically pro versions of the Zen 3 architecture, Zen 4 will be the real next-gen player with brand new cores and major IPC gains. That’s not to say Ryzen 6000 is a slouch, far from it actually. But the real news is about Ryzen 7000, which will bring forth a new platform with it.
AM5 will succeed platform AM4 when Ryzen 7000 launches late next year. However, it seems like AM5 might actually have two different I/O dies, according to Koptite7kimi. Supposedly, one for Zen 3D (Ryzen 6000 desktop) and one for Zen 4 (Ryzen 7000). It’s unclear whether these dies are platform-specific (PCH) or Ryzen specific (IOD). If these are indeed IODs then we can assume perhaps this is because Zen 4 is said to have a chiplet design while Zen 3D will most likely feature a monolithic design. However, this also tell us that Zen 3D, previously thought only compatible with AM4, will, in fact, be compatible with AM5 as well.
Regardless, AM5 will support DDR5 memory up to 5200Mhz along with PCIe 5.0 but the new AM5-based 600-series motherboards won’t support PCIe 5.0. Instead, they’ll rely on the 28 PCIe 4.0 lanes stemming from the CPU. Speaking of which, of course with the new AM5 platform we’ll get new 600-series motherboards. Right now, only the X670 (flagship/enthusiast) and B650 (mainstream) chipsets are on the table with A620 a looming question. X670 is said to be so feature-rich that we won’t even get ITX motherboards based on it because there just isn’t enough space to fit everything in. Both X670 and B650 will also feature more NVME 4.0 and USB 3.2 I/O and we may even see native USB 4.0 support.
Ryzen 7000 renders
The above images, rendered by ExecutableFix give us a good look at the actual size and shape of the Ryzen 7000 chips inside the socket. As you can see, the processor will essentially be a perfect 45mm x 45mm square with a rather fortified and thick IHS. It’s currently speculated this IHS serves the purpose of providing even cooling across multiple chiplets, but its actual purpose could very well be something else, for all we know.
If you saw those images and thought that socket looked a hell of a lot like an Intel socker, no? Well, that’s because AM5 will officially move AMD from a PGA design to an LGA design socket, which is what Intel uses. The switch to LGA, in specific LGA1718, will eliminate the dread stemming from holding a Ryzen CPU in hand, praying for it to not fall and bend/break its pins. At the same time, it can complicate motherboard repair as now the delicate pins are inside the socket itself.
Finally, it’s time to glance over the graphics side of things. As we all know by now, Ryzen 6000, and subsequently Ryzen 7000 will be powered by RDNA 2 graphics. This will be the first time in history where AMD’s mainstream desktop chips will feature integrated graphics, bringing them on par with Intel. Right now, the core count is still fuzzy but Bilibili’s Enthusiast Citizen says we’ll get either 1 or 2 compute units (CU) which means 64 or 128 cores. On the other hand, Greymon tweeted saying Zen 4 will feature up to 4 CUs, or 256 cores, which might be even more than Ryzen 6000 APUs (both desktop and mobile).
— Greymon55 (@greymon55) December 13, 2021
Let’s dial it back
If all of that got a bit confusing for you, let me reiterate the terminology so you can be all caught up. Right now, we’re on Ryzen 5000 based on Zen 3. Ryzen 5000 has both desktop and mobile variants, along with “G-series” desktop APUs which have the Vega graphics architecture. This is supposed to be followed up by Ryzen 6000 APUs at CES 2022, boasting RDNA 2 graphics. These are only mobile APUs and they’re based on the Zen 3+ architecture, so most likely a monolithic design.
After that, we’ll get Ryzen 7000 which is the proper successor to Ryzen 5000. Ryzen 7000 is based on Zen 4 architecture and also feature RDNA 2 graphics. Lastly, after Ryzen 7000 desktop, we will see the release of Ryzen 6000 desktop APUs in late 2022. These will be based on the Zen 3D design, have RDNA 2 iGPUs and will technically be one step below the Zen 4-based Ryzen 7000 processor. Codenames for all of these can be seen below.
2021: Ryzen 5000
Desktop codename: Vermeer
Laptop/Mobile codename: Cezanne
Microarchitecture: Zen 3 (based on 7nm fabrication process from TSMC)
2022: Ryzen 6000
Desktop codename: Vermeer-X3D (unconfirmed rumor)
Laptop/Mobile codename: Rembrandt
Microarchitecture: Zen 3+ for mobile, Zen3D for desktop (based on 6nm fabrication process from TSMC)
2023: Ryzen 7000
Desktop codename: Raphael
Laptop/Mobile codename: Phoenix (standard), Raphael (high-end)
Microarchitecture: Zen 4 (based on 5nm fabrication process from TSMC)