Intel is actively promoting the idea of assembling and running multiple customized CPUs on a single die package. The company recently joined the CHIPS Alliance and even contributed to the Advanced Interface Bus (AIB) Standard. Intel hopes to foster broader adoption of the standard, which in turn, could spur the development of applications and platforms that take advantage of the same.
Intel has grabbed a seat on the governing board of the CHIPS Alliance. The association with the alliance should not only help Intel but also other companies that work with integrated circuits and high-intensity or job-specific semiconductors. Simply put, Intel is attempting to actively collaborate with the CHIPS Alliance to boost the development and adoption of the AIB Standard.
Intel Shares Crucial Details About Advanced Interface Bus (AIB) With CHIPS Alliance:
The CHIPS Alliance officially acknowledged Intel, one of the leading semiconductor or processor manufacturers has joined as its newest member. Interestingly, immediately upon joining, Intel contributed the Advanced Interface Bus (AIB) to the CHIPS Alliance.
The Advanced Interface Bus is an open-source, royalty-free, PHY-level standard for connecting multiple semiconductors dies within the same package. Intel claims the goodwill gesture will encourage an industry environment in which silicon IP can be developed using any semiconductor process as a “chiplet.” The AIB Standard should also allow for easier integration with other chiplets into a single device to deliver new levels of functionality and optimization.
Simply put, the AIB standard will immediately open up the possibilities of heavily customizing processors with task-specific design and requirements. In their prevalent state, CPUs and other semiconductors come in a preset die that is quite difficult to customize. Moreover, end-users often do not need a few components on the die but have to acquire the entire processor. This unnecessarily builds up costs as well as makes development costly.
With the wider adoption of the AIB Standard and eventual design and deployment of the Chiplet architecture, device developers and software engineers will be able to scale and grow beyond the limits of industry-standard monolithic semiconductor manufacturing. As mentioned above, finetuning the actual physical hardware of the processors should reduce the cost of development by not only reducing the cost of semiconductor procurement, but also software coding.
Intel Hopes The World Of Consumer Electronics And IoT Adopts The AIB Standard?
Intel is clearly hoping that its association with the CHIPS Alliance will substantially boost the innovation and subsequent adoption of the customized device and chiplet design. The AIB technical details will soon be available on the CHIPS Alliance GitHub Page. Incidentally, Intel and the CHIPS Alliance will develop the AIB specifications and collateral as part of the Interconnects Workgroup. As expected, the group has assured it would start working immediately. The group also plans to make new contributions, which should foster increased innovation and adoption of the new AIB specifications quickly.
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Speaking about the new joinee and the expected development of the AIB Standard, Dr. Zvonimir Bandić, Chairman, CHIPS Alliance, and senior director of next-generation platforms architecture at Western Digital said,
“We couldn’t be happier to welcome Intel to CHIPS Alliance. Intel’s selection of CHIPS Alliance for the AIB specifications affirms the leading role that the organization impacts on open-source hardware and software development tools. We look forward to the faster adoption of AIB as an open-source chiplet interface.”
The CHIPS Alliance is hosted by the Linux Foundation. Its primary agenda is to help encourage a more open-source/collaborative environment for the creation and deployment of open SoCs, peripherals, and software tools. The Alliance is primarily geared towards accelerating the development of open-source tools for the rapidly emerging technologies that go into consumer electronics. The Alliance is also helping boost collaboration within the Internet of Things (IoT) applications and standards.