Intel Alder Lake-S Desktop CPUs With 150W TDP To Slot Inside New LGA 1700 Socket And Work With DDR5 Memory

Intel’s 12th-Gen Alder Lake-S Desktop CPUs will work on motherboards with the new LGA 1700 Socket. These powerful and still-in-development processors will succeed the Intel’s 11th-Gen Rocket Lake, which is slated to arrive next year. These 12th-Gen Intel chips will be most likely based on the 10nm fabrication node.

Intel seems to have confirmed that their next-generation Alder Lake-S desktop CPUs will be accommodated on the new LGA 1700 Socket. These are by far the most significantly evolved processors as they will be based on a new architectural design. Simply put, Intel is reportedly taking a significant leap in IPC gains and performance with the 12th-Gen CPUs. However, these processors will have a rather high TDP profile and could be intended for intensive computational tasks despite being marketed to the desktop PC buyer.

Intel’s 12th Gen Desktop CPUs Confirmed To Work On New LGA 1700 Socket Platform And Be Compatible With DDR5 Memory:

The Intel 11th-Gen Rocket Lake is the company’s first true transitionary processor and most likely the last to be manufactured on the archaic 14nm Fabrication Node. In other words, Rocket Lake packs a 14nm backport of a next-gen core architecture which is said to be a hybrid between Sunny Cove and Willow Cove while featuring Xe Graphics.

The succeeding Alder Lake chips will be making use of next-gen Golden Cove cores. Incidentally, it is not just the new architecture, but the choice of design and deployment of these cores that’s more important. With the Alder Lake chips,Intel is adopting the big.LITTLE approach. Simply put, Intel will be integrating both Golden Cove and Gracemont cores on a single-chip while also featuring next-generation Xe enhanced graphics engine.

The Rocket Lake chips will work on the LGA 1200 socket, but the Alder Lake will require a brand-new motherboard with LGA 1700 Socket. It is this information that Intel has confirmed by posting the support datasheet for Alder Lake-S on LGA 1700 over at its Development Resource webpage.

LGA 1700 Socket Means No Backward Compatibility But Ample New Features:

The LGA 1700 utilizes a very different layout. It is essentially a larger rectangular slot measuring 45mm x 37.5mm. Traditionally, Intel’s processors have slotted inside a square slot. Apart from the physical difference in shape, the LGA 1700 Socket sporting motherboards, will be the first to support DDR5 memory.

While the reports are unconfirmed, these new motherboards with LGA 1700 Socket should be able to accommodate DDR5-4800 memory on 6-layer and DDR5-4000 on the 4-layer. Needless to add, this is a significant jump over the current native speeds of DDR4-2933 MHz.

[Image Credit: WCCFTech]
The Intel 12th-Gen Alder Lake-S CPUs could launch by late next year or early 2022. Persistent reports have indicated that these CPUs will be the first commercially viable and desktop-grade components fabricated on the 10nm++ Node and featuring the hybrid big.LITTLE design. Apart from the architecture and layout, these CPUs will also feature an enhanced variant of the Xe GPU.

Rumors indicate Intel is attempting performance scaling of Alder Lake-S CPUs with TDPs as high as 150W. Such a high TDP profile Intel CPU could be competing against the AMD Ryzen 9 3950X 16 core processor in the high-end desktop computing segment.


Alap Naik Desai

A B.Tech Plastics (UDCT) and a Windows enthusiast. Optimizing the OS, exploring software, searching and deploying solutions to strange and weird issues is Alap's main interest.
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