Intel 10th-Gen Comet Lake-S To Arrive Early Next Year With 10 Cores, But Will Be Based On Old 14nm Fabrication Tech

Intel could be readying 10th Gen Comet Lake-S processors. A series of slides, that were leaked recently, indicate Intel will launch its new mainstream desktop series early next year. The Intel Comet Lake-S will also be called the 10th Gen Core Series. They will reportedly pack a higher number of cores. Moreover, Intel is segregating the series further into the three main power tiers. The new Intel CPUs will also require 400-series motherboards. This is because the company has changed the compatible socket architecture to LGA 1200. Experts indicate this could be the last of Intel’s CPUs that would be manufactured on the increasingly archaic and overused 14nm fabrication process. In other words, Intel is expected to quickly shit to the 7nm fabrication process for CPUs that could launch in the second half of 2020.

Intel was rumored to be chasing AMD on the latter’s successful transition to the new CPUs that are being made on the 7nm fabrication process. Interestingly, instead of trying to adopt the new manufacturing process to boost the capabilities of its processors, Intel appears to have taken a slightly different but more traditional route. Intel could be readying a new chipset supporting up to 10-core CPUs built on the company’s tried and tested 14nm process. Incidentally, these CPUs will require a new CPU socket. This is primarily because the new Intel CPUs have differing and higher power requirements owing to their higher core count. The new socket will offer higher power delivery and capability of its desktop motherboards.

Intel 10th Gen Comet Lake-S Processors To Fit Inside LGA 1200 Socket:

According to a set of slides that leaked online recently, the new Intel 10th Gen Comet Lake-S CPUs will certainly require a new socket to work. The slides indicate the socket will be LGA 1200 and the motherboards will be 400-Series. The new CPUs will be divided into three power tiers: 125W, 65W and 35W. Needless to mention, these are certainly higher power ratings, but the top-end Intel CPUs will pack 10 Cores and 20 threads.

The new Intel Comet Lake CPUs can be identified by looking for “U” or “Y” in their model names. Strangely, even the Intel’s Ice Lake processors are technically U- and Y-series products, but the company never specifically identifies them as such. Instead, Intel chose to add “G-number” to the end. The label also indicates that the Ice Lake processors feature the new Iris Plus graphics.

The new Intel CPUs should also support the fast LPDDR4x memory in laptops. This is an interesting and needed evolutionary stage in the Intel CPU development because manufacturers can now install the latest, high-bandwidth and low latency LPDDR4x SODIMM memory into their laptops. These new Intel CPUs pack the same support for Thunderbolt 3 and Wi-Fi 6 (integrated 802.11ax) found in other 10th Gen processors. Quite recently we reported about Intel Project Athena, and these new Intel CPUs could appear in machines with the “Project Athena” sticker. This is primarily because the processors have been confirmed to offer the required battery endurance and efficiency.

Intel Boosts CPU TDP To Compete Against AMD?

The leaked slides indicate Intel is finally boosting the allowable TDP for performance. Incidentally, Intel CPU power consumption currently has little relation to TDP. This especially true for the CPU during its Boost Mode. TDP is traditionally measured at the base clock of the CPU and not boost clock speeds. Hence, it is quite likely that Intel may need to further tweak or expand TDP to address the higher core count. In the past, the company managed to keep the majority of its CPUs in the same TDP bracket by limiting the base clock.

The higher TDP rating on the new Intel 10th Gen Comet Lake-S processors could the company’s way of retaining its traditional technique of ensuring uniformity. While Intel could once again restrict the base clock in order to stick to the highly reliable 95W TDP, it can no longer afford to ignore AMD’s rising influence in the desktop CPU market.

The 400-Series motherboard needed to support the new Intel CPUs may feature 49 additional pins for higher power delivery. It is important to note that besides the higher 125W TDP CPUs, Intel will still support and possibly release the 65W and even 35W TDP CPUs on the 14nm fabrication process. It is only the hardcore or enthusiast TDP bracket that would go up to 125W. As with most of Intel’s CPUs, the temporary boost clocks would as high possible on these new processors as well.

Incidentally, the AMD 16-core Ryzen 9 3950X is already on its way. Intel placing a 10 Core CPU against the 16-core AMD Threadripper may not seem like a game-changer. However, Intel appears to be playing to its strengths instead of competing purely on the core count.


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