Much like last year’s Apple A12 Bionic chip, this year’s A13 chip will be manufactured by TSMC. According to a new report out of Taiwan, the upcoming Apple A13 chipset will be built using an enhanced version of TSMC’s N7+ fabrication process, incorporating EUV technology.
The new process, reportedly dubbed N7 Pro, will be ready for mass production before the end of the second quarter. Sadly, however, the report does not list the key improvements that the new N7 Pro fabrication process brings to the table. So far, it has only been confirmed that Apple A13 will be the first chipset to utilize the new process. While not much is known currently, we expect more information to surface online in the near future.
Since the Apple A12 Bionic was not a huge upgrade over the A11 in terms of performance, the A13 will likely be a very significant upgrade over the A12. Thanks to the improved fabrication process, it is expected to be more efficient as well. The Apple A13 chip will power the Cupertino-based firm’s upcoming iPhones, which will debut in September.
The same report also claims TSMC will begin fabricating HiSilicon’s next-generation Kirin 985 mobile SoC using a 7nm N7+ EUV process node in the second quarter of the year. HiSilicon’s Kirin 985 chipset is expected to power the Huawei Mate 30 series flagship smartphones, which are likely to be unveiled in the fourth quarter of the year.
As confirmed by TSMC previously, the company’s 5nm process technology will be ready for risk production in the first half of the year. By the end of the year or by early next year, TSMC hopes to begin volume production of the first 5nm chips. It is highly likely that next year’s Apple A14 chip will be built using a 5-nanometer production process.